April 11, 2024

Backplane Systems Technology is pleased to present IBase’s RM-QCS6490-S.  IBase Technology Inc. has unveiled its RM-QCS6490-S Wide-Temperature System on Module (SOM) featuring the advanced Qualcomm QCS6490 Processor, marking a significant advancement in the realm of industrial Internet of Things (IoT) applications. This cutting-edge SOM module is designed to withstand harsh environments, offering a wide operating temperature range from -25°C to +75°C, making it an ideal solution for rugged handhelds, tablets, kiosks, Point of Sale (POS) systems, and human-machine interface (HMI) systems.

The RM-QCS6490-S stands out with its impressive video capabilities, supporting 4K@60FPS video decoding and 4K@30FPS video encoding, along with an AI performance of 12.5 TOPS that empowers businesses to leverage artificial intelligence (AI) in challenging conditions. It also includes a variety of peripheral interfaces such as GPIO, UART, I2C, I3C, SPI, DSI, USB 3.1, and PCI-E, ensuring versatile connectivity options.

IBASE’s commitment to long-term supply with Qualcomm’s solution further enhances the module’s appeal to industrial sectors seeking reliable and durable computing solutions. The collaboration between IBASE and Qualcomm Technologies, Inc. has been instrumental in delivering these next-generation edge AI solutions. As highlighted by Dev Singh from Qualcomm and Albert Lee from IBASE, this partnership aims to transform edge computing with sophisticated, AI-focused modules, paving the way for new possibilities in industrial IoT applications.

 

Key Features:

  • SOM (System on Module) is integrated with Qualcomm® QCS6490 SoC
  • Video: 4K@60FPS video decoding; 4K@30FPS video encoding
  • AI Performance: 12.5 TOPS
  • Peripheral Interfaces, including GPIO, UART, I2 C, I3 C, SPI, DSI, USB 3.1, and PCI-E
  • Long-term supply with Qualcomm solution
  • Wide-range operating temperature (-25°C~75°C)
SiER-G4201M

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NRU-52S+

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SiER-G2201M

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RM-QCS6490-S

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SiER-G1101M

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