Backplane Systems Technology is pleased to present Neousys POC-700. Neousys Technology’s POC-700 series is a breakthrough in ultra-compact embedded computing, offering advanced processing capabilities with the latest Intel® Alder Lake Core™ i3-N305 or Atom® x7425E processors. This series is engineered to deliver remarkable performance improvements, up to 1.3 times greater CPU performance compared to its predecessor, the POC-500 series.
The POC-700 series boasts a robust design, capable of operating in extreme temperatures ranging from -25 °C to 70 °C, making it suitable for rugged industrial environments. It supports up to 16GB DDR5-4800 SODIMM, enhancing system performance with up to 1.8 times the memory bandwidth of DDR4 modules.
Connectivity is a strong suit of the POC-700 series. It is equipped with four Gigabit Ethernet ports with Power over Ethernet Plus (PoE+) capabilities and four USB3.2 Gen 2 ports with screw-lock features, ensuring secure and reliable connections for industrial cameras in machine vision applications.
For display and expansion, the POC-700 series offers dual display outputs via DP++ and HDMI 1.4b and features isolated digital inputs and outputs for device monitoring and control. The M.2 2280 M key socket and a mini-PCIe slot offer additional expansion capabilities for SATA SSDs and wireless connectivity modules, respectively.
Designed for front I/O access and DIN-mounting, the POC-700 series is compatible with the MezIO® interface, providing versatile expansion options. Its ultra-compact dimensions (64 x 116 x 176mm) make it an ideal upgrade from the POC-500 series, sharing the same footprint for easy integration.
Ideal for machine vision and smart city applications, the Neousys POC-700 series redefines the potential of embedded systems with its enhanced processing power, extensive connectivity, and rugged durability—all packed into an ultra-compact form factor.